Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

AJ Pickwell; RA Dorey; D Mba

doi:10.1109/TUFFC.2011.2043

Back

Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

Journal article

Peer reviewed

Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

AJ Pickwell, RA Dorey and D Mba

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, Vol.58(9), pp.1994-2000

01/09/2011

DOI: https://doi.org/10.1109/TUFFC.2011.2043

Abstract

Science & Technology

Technology

Acoustics

Engineering

Electrical & Electronic

Engineering

ACOUSTICS

ENGINEERING

ELECTRICAL & ELECTRONIC

PIEZOELECTRIC PROPERTIES

Files and links (1)

url

http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000295101600037&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=11d2a86992e85fb529977dad66a846d5View

Author

Metrics

Details

Title: Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications
Creators: AJ Pickwell
RA Dorey
D Mba
Publication Details: IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, Vol.58(9), pp.1994-2000
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Publication Date: 01/09/2011
Identifiers: 99514711802346; WOS:000295101600037
Academic Unit: University of Surrey
Language: English
Resource Type: Journal article

Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

Abstract

Files and links (1)

Metrics

Details

Usage Policy