Abstract
The severe mechanical environment that electronic components experience during spacecraft launch necessitates that their failure probability be assessed. One possible approach is to create an accurate model of the Printed Circuit Boards (PCBs) dynamic response; subsequently the failure probability can be determined by comparing the response model with corresponding failure criteria for the electronic components. In principle the response model can be achieved by a very detailed Finite Element (FE) model of the PCB which would include the mass and stiffness of all components present on the PCB. Unfortunately this approach requires an excessive effort; therefore it is rarely pursued by the designer. Past research has shown that assumptions can be made about the mass and stiffness that allow simpler models to be created that still achieve appropriate levels of accuracy. However, the accuracy of these simplified models has not yet been quantified over a range of possible design cases. This paper will quantify how increasing levels of modelling simplifications decrease the accuracy of PCB FE models.