Thermal residual stress analysis of epoxy bi-material laminates and bonded joints

Journal article

Open access

Peer reviewed

FS Jumbo, IA Ashcroft, AD Crocombe and MMA Wahab

INT J ADHES ADHES, Vol.30(7), pp.523-538

10/2010

Abstract

Epoxy/epoxides

Aluminium alloy

Stress analysis

Thermal residual stress

LOADED BIMATERIAL INTERFACE

ADHESIVE JOINTS

BACKFACE STRAIN

TEMPERATURE

STRENGTH

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http://dx.doi.org/10.1016/j.ijadhadh.2010.03.009View

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Title: Thermal residual stress analysis of epoxy bi-material laminates and bonded joints
Creators: FS Jumbo
IA Ashcroft
AD Crocombe
MMA Wahab
Publication Details: INT J ADHES ADHES, Vol.30(7), pp.523-538
Publisher: ELSEVIER SCI LTD
Date published: 10/2010
Date submitted: 30/06/2014
Identifiers: 99514269902346
Academic Unit: Department of Mechanical Engineering Sciences
Language: English
Resource Type: Journal article