Abstract
We have fabricated a new experimental pixel array using 2mm-thick CdZnTe. The trial arrays have been bump-bonded to the Rockwell PICNIC readout IC which provides low noise read out of pixel signals. First measurements are presented from the detector characterisation, which in particular, demonstrate that a very high bond yield (>99%) was achieved. It is envisaged that these detectors will be suitable for future X-ray astronomy and planetary missions as well as ground based applications such as non-destructive testing, threat detection and baggage scanning.