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An Analytical Model for Defect Depth Estimation Using Pulsed Thermography
Journal article   Peer reviewed

An Analytical Model for Defect Depth Estimation Using Pulsed Thermography

S.L. Angioni, F. Ciampa, F. Pinto, G. Scarselli, D.P. Almond and M. Meo
EXPERIMENTAL MECHANICS, Vol.56(6), pp.1111-1122
21/03/2016

Abstract

Composite materials; Pulsed thermography; Embedded shape memory alloy wires ; Analytical methods; Defect depth; Thermal properties
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https://www.scopus.com/inward/record.uri?eid=2-s2.0-84963785101&doi=10.1007%2fs11340-016-0143-4&partnerID=40&md5=5541e80da8fc646d415b7542456d9bc7View
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