Assessment of Technical and Environmental Performances of Wheat-Based Foams in Thermal Packaging Applications

Y Wang; Y-X Gao; J Song; M Bonin; M Guo; R Murphy

doi:10.1002/pts.897

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Journal article

Assessment of Technical and Environmental Performances of Wheat-Based Foams in Thermal Packaging Applications

Y Wang, Y-X Gao, J Song, M Bonin, M Guo and R Murphy

PACKAGING TECHNOLOGY AND SCIENCE, Vol.23(7), pp.363-382

01/11/2010

DOI: https://doi.org/10.1002/pts.897

Abstract

Science & Technology

Technology

Life Sciences & Biomedicine

Engineering

Manufacturing

Food Science & Technology

Engineering

ENGINEERING

MANUFACTURING

FOOD SCIENCE & TECHNOLOGY

wheat-based foams

renewable

compostable

thermal packaging

FE modelling

LCA

environmental impact

TEMPERATURE

SYSTEMS

CYCLE

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Title: Assessment of Technical and Environmental Performances of Wheat-Based Foams in Thermal Packaging Applications
Creators: Y Wang
Y-X Gao
J Song
M Bonin
M Guo
R Murphy
Publication Details: PACKAGING TECHNOLOGY AND SCIENCE, Vol.23(7), pp.363-382
Publisher: JOHN WILEY & SONS LTD
Publication Date: 01/11/2010
Identifiers: 99511085802346; WOS:000283671400001
Academic Unit: University of Surrey
Language: English
Resource Type: Journal article

Assessment of Technical and Environmental Performances of Wheat-Based Foams in Thermal Packaging Applications

Abstract

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