Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

RA Amy; GS Aglietti; G Richardson

doi:10.1109/TEPM.2010.2084092

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Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

Journal article

Peer reviewed

Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

RA Amy, GS Aglietti and G Richardson

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, Vol.33(4), pp.303-311

01/10/2010

DOI: https://doi.org/10.1109/TEPM.2010.2084092

Abstract

Science & Technology

Technology

Engineering

Manufacturing

Engineering

Components

components screening

failure criteria

printed circuit board (PCB) vibrations

testing

vibration endurance

vibration failure

ELECTRONIC EQUIPMENT

FATIGUE

RELIABILITY

COMPONENTS

PREDICTION

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Title: Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach
Creators: RA Amy
GS Aglietti
G Richardson
Publication Details: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, Vol.33(4), pp.303-311
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Date published: 01/10/2010
Date submitted: 28/07/2016
Identifiers: 99510983102346
Academic Unit: University of Surrey
Language: English
Resource Type: Journal article

Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

Abstract

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