New materials for micro-scale sensors and actuators An engineering review

SA Wilson; RPJ Jourdain; Q Zhang; RA Dorey; CR Bowen; M Willander; QU Wahab; MA-H Safaa; O Nur; E Quandt; C Johansson; E Pagounis; M Kohl; J Matovic; B Samel; W van der Wijngaart; EWH Jager; D Carlsson; Z Djinovic; M Wegener; C Moldovan; R Iosub; E Abad; M Wendlandt; C Rusu; K Persson

doi:10.1016/j.mser.2007.03.001

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New materials for micro-scale sensors and actuators An engineering review

Journal article

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New materials for micro-scale sensors and actuators An engineering review

SA Wilson, RPJ Jourdain, Q Zhang, RA Dorey, CR Bowen, M Willander, QU Wahab, M Willander, MA-H Safaa, O Nur, …

MATERIALS SCIENCE & ENGINEERING R-REPORTS, Vol.56(1-6), pp.1-129

21/06/2007

DOI: https://doi.org/10.1016/j.mser.2007.03.001

Abstract

Science & Technology

Technology

Physical Sciences

Materials Science

Multidisciplinary

Physics

Applied

Materials Science

Physics

MATERIALS SCIENCE

MULTIDISCIPLINARY

PHYSICS

APPLIED

piezoelectric

magnetic

shape memory

polymer

microstructure

microtechrology

NI-MN-GA

FERROMAGNETIC SHAPE-MEMORY

FIELD-INDUCED STRAIN

HIGH-ASPECT-RATIO

PZT THIN-FILMS

CELLULAR POLYPROPYLENE FILMS

CHEMICAL-VAPOR-DEPOSITION

ATOMIC-FORCE MICROSCOPY

MICROMACHINED ULTRASONIC TRANSDUCERS

MICROELECTROMECHANICAL SYSTEMS MEMS

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Title: New materials for micro-scale sensors and actuators An engineering review
Creators: SA Wilson
RPJ Jourdain
Q Zhang
RA Dorey
CR Bowen
M Willander
QU Wahab
M Willander
MA-H Safaa
O Nur
E Quandt
C Johansson
E Pagounis
M Kohl
J Matovic
B Samel
W van der Wijngaart
EWH Jager
D Carlsson
Z Djinovic
M Wegener
C Moldovan
R Iosub
E Abad
M Wendlandt
C Rusu
K Persson
Publication Details: MATERIALS SCIENCE & ENGINEERING R-REPORTS, Vol.56(1-6), pp.1-129
Publisher: ELSEVIER SCIENCE SA
Date published: 21/06/2007
Date submitted: 17/05/2017
Identifiers: 99512497002346
Academic Unit: University of Surrey
Language: English
Resource Type: Journal article

New materials for micro-scale sensors and actuators An engineering review

Abstract

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