MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE

S IEZEKIEL; EA SOSHEA; MF OKEEFE; CM SNOWDEN

doi:10.1109/22.414598

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MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE

Journal article

Peer reviewed

MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE

S IEZEKIEL, EA SOSHEA, MF OKEEFE and CM SNOWDEN

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, Vol.43(9), pp.2421-2427

01/09/1995

DOI: https://doi.org/10.1109/22.414598

Abstract

Science & Technology

Technology

Engineering

Electrical & Electronic

Engineering

ENGINEERING

ELECTRICAL & ELECTRONIC

OPTICAL CONNECTIONS

HYBRID INTEGRATION

WAVE-GUIDES

DEVICES

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Title: MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE
Creators: S IEZEKIEL
EA SOSHEA
MF OKEEFE
CM SNOWDEN
Publication Details: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, Vol.43(9), pp.2421-2427
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Date published: 01/09/1995
Date submitted: 16/05/2017
Identifiers: 99511617602346
Academic Unit: University of Surrey
Language: English
Resource Type: Journal article

MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE

Abstract

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