HIGH-SPEED OPTOELECTRONIC MULTICHIP MODULES PACKAGED IN GLASS ON SILICON

S IEZEKIEL; EA SOSHEA; MFJ OKEEFE; CM SNOWDEN

doi:10.1117/12.175260

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HIGH-SPEED OPTOELECTRONIC MULTICHIP MODULES PACKAGED IN GLASS ON SILICON

S IEZEKIEL, EA SOSHEA, MFJ OKEEFE and CM SNOWDEN

TECHNOLOGIES FOR OPTICAL FIBER COMMUNICATIONS, Vol.2149, pp.213-224

Conference on Technologies for Optical Fiber Communications (LOS ANGELES, CA, 25/01/1994)

01/01/1994

DOI: https://doi.org/10.1117/12.175260

Abstract

Science & Technology

Technology

Physical Sciences

Engineering

Electrical & Electronic

Optics

Telecommunications

Engineering

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Title: HIGH-SPEED OPTOELECTRONIC MULTICHIP MODULES PACKAGED IN GLASS ON SILICON
Creators: S IEZEKIEL
EA SOSHEA
MFJ OKEEFE
CM SNOWDEN
Contributors: GJ Brown
DJ Decoster
JS LaCourse
YS Park
KD Pedrotti
SR Sloan
SPIE - INT SOC OPTICAL ENGINEERING (Publisher)
Publication Details: TECHNOLOGIES FOR OPTICAL FIBER COMMUNICATIONS, Vol.2149, pp.213-224
Conference: Conference on Technologies for Optical Fiber Communications (LOS ANGELES, CA, 25/01/1994)
Date published: 01/01/1994
Date submitted: 16/05/2017
Identifiers: 99512435602346
Academic Unit: University of Surrey
Resource Type: Conference presentation

HIGH-SPEED OPTOELECTRONIC MULTICHIP MODULES PACKAGED IN GLASS ON SILICON

Abstract

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