Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD

W Batty; CE Christoffersen; S David; AJ Panks; RG Johnson; CM Snowden; MB Steer

doi:10.1109/STHERM.2001.915149

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Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD

W Batty, CE Christoffersen, S David, AJ Panks, RG Johnson, CM Snowden and MB Steer

SEVENTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2001, pp.71-84

17th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SAN JOSE, CA, 20/03/2001 - 22/03/2001)

01/01/2001

DOI: https://doi.org/10.1109/STHERM.2001.915149

Abstract

Science & Technology

Technology

Engineering

Electrical & Electronic

Engineering

thermal

electrothermal

compact modelling

non linear CAD

power FETs

circuits

MICROWAVE INTEGRATED-CIRCUITS

NONLINEAR BOUNDARY-CONDITIONS

NUMERICAL INVERSION

DIFFUSION-PROBLEMS

SIMULATION

ICS

CONDUCTIVITY

TRANSIENTS

HYBRID

TOOL

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Title: Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD
Creators: W Batty
CE Christoffersen
S David
AJ Panks
RG Johnson
CM Snowden
MB Steer
Contributors: IEEE (Publisher)
Publication Details: SEVENTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2001, pp.71-84
Conference: 17th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SAN JOSE, CA, 20/03/2001 - 22/03/2001)
Date published: 01/01/2001
Date submitted: 16/05/2017
Identifiers: 99511938202346
Academic Unit: University of Surrey
Resource Type: Conference presentation

Fully physical time-dependent compact thermal modelling of complex non linear 3-dimensional systems for device and circuit level electro-thermal CAD

Abstract

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